ÇѾç´ëÇб³ ³ª³ëÀüÀÚ¼ÒÀÚ ¹× Àç·á¿¬±¸½Ç
Nano Electronic Devices & Materials Laboratory
º» ¿¬±¸½Ç¿¡¼´Â Â÷¼¼´ë ·ÎÁ÷ ¼ÒÀÚ, ¸Þ¸ð¸® ¼ÒÀÚ, ´º·Î¸ðÇÈ ¼ÒÀÚ ¹× ½Ã½ºÅÛ, 3Â÷¿ø ÁýÀû ¼ÒÀÚ ºÐ¾ß¿¡¼ ´Ù¾çÇÑ ÀüÀÚ Àç·á, ¹ÝµµÃ¼ °øÁ¤ ¹× ºÐ¼®À» Ȱ¿ëÇÏ¿© ¿¬±¸¸¦ ¼öÇàÇϰí ÀÖ½À´Ï´Ù. Àç·áÀÇ ¹°¸®/ÈÇÐÀû Ư¼ºÀ» ÀÌÇØÇϰí À̸¦ ¹ÙÅÁÀ¸·Î ¹ÝµµÃ¼ ¼ÒÀÚ¸¦ Á¦ÀÛÇϰí Àü±â/±¤ÇÐ/ÈÇÐ/¹°¸®ÀûÀΠƯ¼ºÀ» ºÐ¼®/ÇØ¼®ÇÕ´Ï´Ù.
Our research activities consist of material, process, device and characterization for various advanced semiconductor devices in logic, memory, neuromorphic and monolithic 3D integration.
Our research activities consist of material, process, device and characterization for various advanced semiconductor devices in logic, memory, neuromorphic and monolithic 3D integration.
Recent News more
-
[Lab Story] Â÷¼¼´ë ¹ÝµµÃ¼ »ê¾÷À» À̲ø ±â¼ú ¿¬±¸, NEDML2026-07-13 -
Symposium on VLSI Technology and Circuits ÇÐȸ ¹ßÇ¥!2026-07-13
Gallery more
-
2026³â 4, 5, 6 ¿ù »ýÀÏÆÄÆ¼2026-06-29 -
2026 ½º½ÂÀÇ ³¯2026-05-19
Journal more
-
Donguk Kim, Young Seo Na, Yehbeen Im, Kangbaek Seo, Seungchae Lee and Changhwan Choi*, "Plasma-thermal atomic layer etching of molybdenum using CF4 surface fluorination and Ar plasma removal", accepted, Applied Surface Science, 2026
Conference more
-
ÃÖâȯ, "ÇÏÀ̺긮µå º»µù °øÁ¤ ±â¼ú °³¹ß ¹× ÀÀ¿ë [ÃÊû¹ßÇ¥]", ´ëÇÑÀüÀÚ°øÇÐȸ ÇϰèÁ¾ÇÕÇмú´ëȸ, Á¦ÁÖ·Ôµ¥È£ÅÚ, 26.06

